This year, FOCI Fiber Optic Communications, Inc. launched ReLFACon^TM (Reflowable Lensed Fiber Array Connector) products for Optical Switch, HPC, AI, ML, Lidar and Sensor.

The ReLFACon^TM product is to install the optical fiber array connector in the silicon photonics co-packaged optics (CPO) component to complete complex tasks such as high-speed transmission and high-performance computing and accelerate the market's demand for silicon photonics-based transmission architecture.  This optical element can meet the process environment requirements required by standard semiconductor packaging and can effectively achieve output and input of 8~128 channels, greatly improving the data transmission efficiency.

Image source：FOCI

Hu Dingda, president of FOCI, said, “This new type of optical fiber array connector can meet the existing silicon photonics co-packaging platform and meet the optical transmission needs of high-speed transmission/high-performance computing customers. Our products have achieved the goal of mass automated production of optical fiber array connectors and will become a pioneer in large-scale manufacturing and standard semiconductor packaging, providing key optical components for the optical communication industry of high-speed transmission and computing. ReLFACon^TM uses materials that are resistant to reflow and match the expansion coefficient of semiconductor silicon wafers. Compared with traditional optical fiber array connectors, it will enable co-packaged optical components to have better workability and reliability.  In addition, FOCI also provides multi-channel optical fiber passive components and optical solutions for silicon photonics co-packaging, such as: FA and MPO multi-channel polarization-maintaining fiber array packaging.”

FOCI Fiber Optic Communications Inc. will showcase its solutions for high-speed transmission, large data computing and co-packaged optical components at the DesignCon 2023 exhibition at the Santa Clara Convention Center from 1/31 to 2/2, 2023.