Technologies
FOCI Technologies
High Accuracy Photonic Integration Technologies
FOCI can integrate the demands of both vendor and client. We offer total solutions for customer specific product designs, such as customized optical transceiver products, co-packaged optics systems, etc…Please contact our Sales Team for further discussion.
FOCI provide full chip-level to module integrated solutions, from die-bond, wire-bond, seam seal, and laser welding.
The single-channel/ multi-channels assemble technologies are producing the performance photonics interconnected products.
We can offer:
- Eutectic die bonding
- Expoxy die bonding
- Wire bonding
- Plasma cleaning
- CoC Level Brun-in
- Lens bonded
- Active lens (Micro-Optics) alignment
- Seam welding
- Laser welding
- Optical fiber and hybrid cable assembling
- Module assembling and testing
Eutectic Die Bonding
Chip on carrier assembly
Epoxy Die Bonding / Wire Bonding
Chip on Board process (COB)
Laser/PD Box type package
Laser/PD Box type package
Active / Passive Lens Bonding
Active lens alignment
Passive lens attached
CoC Level Burn-In
COC Burn-in to identify potentially defective devices
Laser Welding
Active optical alignment for metal parts welding.
Metal pars welding
Module Assembly and Testing
Transceiver and AOC product assembly
Transceiver and AOC performance check.
Optical Hybrid Cable Assembly
Consumer product – USB, HDMI, DisplayPort
Seam Welding
Hermetic seal for Box type package